Thermoelastic fracture mechanics analysis on electronic packaging using boundary element method

The demand for Integrated Circuit (IC) has increased tremendously over the years and the dependence on it has become overwhelming. Its usages range from daily appliances to sophisticated micro processors. Hence, this motivates researchers to design and improve the IC constantly. The size of the IC c...

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Main Author: Kuek, Choon Han.
Other Authors: Ang Hock Eng
Format: Final Year Project
Language:English
Published: 2010
Subjects:
Online Access:http://hdl.handle.net/10356/40322
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-403222023-03-04T18:34:14Z Thermoelastic fracture mechanics analysis on electronic packaging using boundary element method Kuek, Choon Han. Ang Hock Eng School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics The demand for Integrated Circuit (IC) has increased tremendously over the years and the dependence on it has become overwhelming. Its usages range from daily appliances to sophisticated micro processors. Hence, this motivates researchers to design and improve the IC constantly. The size of the IC chip mounted in the plastic packages is increased to improve its capacity and functionality. At the same time, the package thickness has been made smaller and thinner in order to accommodate a larger number of packaged chips on the Printed Circuit Board (PCB). However, these have caused the reliability of the IC to deteriorate due to the aspect ratio between the package and the IC chip. Hence, the cracking at the interface of the dissimilar materials has become an alarming issue. The Boundary Element Method was used to analyze the fracture behavior of a typical IC package under both mechanical and thermal loads. The geometries and aspect ratios of the IC package were varied and its effects on the structural integrity of the IC package were analyzed. The results show that the thickness of the resin under the chip pad plays a significant role in the fracture characteristic parameters. Under mechanical loading, thicker resin thickness under the chip pad provides better resistance to the mechanical stress. However, under thermal loading, a thinner layer of resin under the chip pad exhibit lower stress intensity factor at the crack tip. From the analysis, it is suggested that the ratio of the thickness of the resin to the chip pad should be kept at the range of 1.5 to 2.0 and the ratio of the crack size to the width of the IC package should be kept at less than 0.5. Hence, the reliability of the IC packages can be further improved with the suggested aspect ratios. Bachelor of Engineering (Mechanical Engineering) 2010-06-14T08:26:08Z 2010-06-14T08:26:08Z 2010 2010 Final Year Project (FYP) http://hdl.handle.net/10356/40322 en Nanyang Technological University 99 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
spellingShingle DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
Kuek, Choon Han.
Thermoelastic fracture mechanics analysis on electronic packaging using boundary element method
description The demand for Integrated Circuit (IC) has increased tremendously over the years and the dependence on it has become overwhelming. Its usages range from daily appliances to sophisticated micro processors. Hence, this motivates researchers to design and improve the IC constantly. The size of the IC chip mounted in the plastic packages is increased to improve its capacity and functionality. At the same time, the package thickness has been made smaller and thinner in order to accommodate a larger number of packaged chips on the Printed Circuit Board (PCB). However, these have caused the reliability of the IC to deteriorate due to the aspect ratio between the package and the IC chip. Hence, the cracking at the interface of the dissimilar materials has become an alarming issue. The Boundary Element Method was used to analyze the fracture behavior of a typical IC package under both mechanical and thermal loads. The geometries and aspect ratios of the IC package were varied and its effects on the structural integrity of the IC package were analyzed. The results show that the thickness of the resin under the chip pad plays a significant role in the fracture characteristic parameters. Under mechanical loading, thicker resin thickness under the chip pad provides better resistance to the mechanical stress. However, under thermal loading, a thinner layer of resin under the chip pad exhibit lower stress intensity factor at the crack tip. From the analysis, it is suggested that the ratio of the thickness of the resin to the chip pad should be kept at the range of 1.5 to 2.0 and the ratio of the crack size to the width of the IC package should be kept at less than 0.5. Hence, the reliability of the IC packages can be further improved with the suggested aspect ratios.
author2 Ang Hock Eng
author_facet Ang Hock Eng
Kuek, Choon Han.
format Final Year Project
author Kuek, Choon Han.
author_sort Kuek, Choon Han.
title Thermoelastic fracture mechanics analysis on electronic packaging using boundary element method
title_short Thermoelastic fracture mechanics analysis on electronic packaging using boundary element method
title_full Thermoelastic fracture mechanics analysis on electronic packaging using boundary element method
title_fullStr Thermoelastic fracture mechanics analysis on electronic packaging using boundary element method
title_full_unstemmed Thermoelastic fracture mechanics analysis on electronic packaging using boundary element method
title_sort thermoelastic fracture mechanics analysis on electronic packaging using boundary element method
publishDate 2010
url http://hdl.handle.net/10356/40322
_version_ 1759856157104537600