Thermoelastic fracture mechanics analysis on electronic packaging using boundary element method

• Main Author: Kuek, Choon Han.
• Other Authors: Ang Hock Eng
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
• Online Access: http://hdl.handle.net/10356/40322
• Institution: Nanyang Technological University

The demand for Integrated Circuit (IC) has increased tremendously over the years and the dependence on it has become overwhelming. Its usages range from daily appliances to sophisticated micro processors. Hence, this motivates researchers to design and improve the IC constantly. The size of the IC c...