Novel via technology for high current densities

• Main Author: Yeo, Justin Ing Le.
• Other Authors: Christopher Shearwood
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Manufacturing::Product engineering
• Online Access: http://hdl.handle.net/10356/40603
• Institution: Nanyang Technological University

Through-wafer electrical connections are becoming increasingly important for Micro-Electro-Mechanical systems (MEMS). For a MEMS design structure containing electrical components within an enclosed cavity, through-wafer electrical connections would be an ideal solution to supply power to the electri...