Polymer microfluidic devices : sealing and lamination of topas microfluidic devices by thermal bonding

• Main Author: Li, Aaron Shi Wei.
• Other Authors: Yue Chee Yoon
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Mechanical engineering::Fluid mechanics
• Online Access: http://hdl.handle.net/10356/40622
• Institution: Nanyang Technological University

This project aims to evaluate and optimize the thermal bonding parameters in order to fabricate TOPAS Cyclic Olefin Copolymer (COC) micro-channeled devices with good replication accuracy that can withstand the pressures subjected by fluid flow during applications. Micro-channeled plates and blank plates of the different TOPAS COC graded raw materials are produced by an injection molding process. Injection molding is a manufacturing technique that is widely used for mass production of parts and some of the advantages of this process includes high efficiency and low costs. There are numerous techniques and methods of sealing and lamination of micro-fluidic devices and one such method is thermal bonding. Firstly, parameters were determined for optimization in thermal bonding. They are bonding temperature, time and pressure. With the different sets of parameters obtained, burst pressure analysis is carried out to determine the critical burst pressure achieved for each set of parameters. Repeatability tests were carried out to show that the optimized parameter values for each set of material have been established. After burst pressure analysis is carried out, the plates are de-laminated. The confocal imaging profiler was used to analyze all samples and gather data on the profiles of the micro-channels before and after thermal bonding. These additional data provides a comparison for the study on the behavior of the micro-channels under the different sets of parameters and materials. A write-up on the problems faced throughout the project as well as some suggestions on the improvements for future study will be produced. Lastly, a conclusion will be made to sum up on the experiences and lessons learnt throughout this project.