Polymer microfluidic devices : sealing and lamination of topas microfluidic devices by thermal bonding

• المؤلف الرئيسي: Li, Aaron Shi Wei.
• مؤلفون آخرون: Yue Chee Yoon
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2010
• الموضوعات: DRNTU::Engineering::Mechanical engineering::Fluid mechanics
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/40622

This project aims to evaluate and optimize the thermal bonding parameters in order to fabricate TOPAS Cyclic Olefin Copolymer (COC) micro-channeled devices with good replication accuracy that can withstand the pressures subjected by fluid flow during applications. Micro-channeled plates and b...