Polymer microfluidic devices : sealing and lamination of topas microfluidic devices by thermal bonding

• Main Author: Li, Aaron Shi Wei.
• Other Authors: Yue Chee Yoon
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Mechanical engineering::Fluid mechanics
• Online Access: http://hdl.handle.net/10356/40622
• Institution: Nanyang Technological University

This project aims to evaluate and optimize the thermal bonding parameters in order to fabricate TOPAS Cyclic Olefin Copolymer (COC) micro-channeled devices with good replication accuracy that can withstand the pressures subjected by fluid flow during applications. Micro-channeled plates and b...