Machining of brittle materials using precision crack-off

• المؤلف الرئيسي: Ma, Ji
• مؤلفون آخرون: Sathyan Subbiah
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2010
• الموضوعات: DRNTU::Engineering::Mechanical engineering::Assistive technology; DRNTU::Engineering::Mechanical engineering::Machine design and construction
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/40675

At present, a high wasteful and time-consuming method is widely used in silicon fabrication industry for slicing silicon wafers. To minimize the cost as well as shorten lead time, a new fabrication method should be brought out. The objective of this project is to verify and develop precision crac...