Machining of brittle materials using precision crack-off

• 主要作者: Ma, Ji
• 其他作者: Sathyan Subbiah
• 格式: Final Year Project
• 語言: English
• 出版: 2010
• 主題: DRNTU::Engineering::Mechanical engineering::Assistive technology; DRNTU::Engineering::Mechanical engineering::Machine design and construction
• 在線閱讀: http://hdl.handle.net/10356/40675

At present, a high wasteful and time-consuming method is widely used in silicon fabrication industry for slicing silicon wafers. To minimize the cost as well as shorten lead time, a new fabrication method should be brought out. The objective of this project is to verify and develop precision crac...