Machining of brittle materials using precision crack-off

• Main Author: Ma, Ji
• Other Authors: Sathyan Subbiah
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Mechanical engineering::Assistive technology; DRNTU::Engineering::Mechanical engineering::Machine design and construction
• Online Access: http://hdl.handle.net/10356/40675
• Institution: Nanyang Technological University

At present, a high wasteful and time-consuming method is widely used in silicon fabrication industry for slicing silicon wafers. To minimize the cost as well as shorten lead time, a new fabrication method should be brought out. The objective of this project is to verify and develop precision crack-off method which can be used for breaking and slicing silicon ingot even all brittle materials. In this report, the author described preparations and procedures of the experiments, such as 3-point bending test, and precision crack-off method on rods with 1 and 2 notches respectively. Based on the experimental result, the author analyzed parameters that affect the surface finish of cracking surface and proposed improved ideas for further experiments. In addition, due to failure of some experiments, the author also gave possible explanations. Furthermore, since the main purpose of this project is to apply a new method to mass production, the author provided a feasible experimental setup to be examined further. Last but not least, the author discussed whether this method can be applied to crystalline materials.