Machining of brittle materials using precision crack-off

• Main Author: Ma, Ji
• Other Authors: Sathyan Subbiah
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Mechanical engineering::Assistive technology; DRNTU::Engineering::Mechanical engineering::Machine design and construction
• Online Access: http://hdl.handle.net/10356/40675
• Institution: Nanyang Technological University

At present, a high wasteful and time-consuming method is widely used in silicon fabrication industry for slicing silicon wafers. To minimize the cost as well as shorten lead time, a new fabrication method should be brought out. The objective of this project is to verify and develop precision crac...