Fabrication of microdisks on silicon for photonic application
As silicon chips advance to future generations with higher densities of transistors and faster clock speeds, the problems with electrical interconnects to and on silicon chips become significantly worse. Silicon based optoelectronic integration offers the promise of low-cost solutions for optical co...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
2010
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| Online Access: | http://hdl.handle.net/10356/40822 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | As silicon chips advance to future generations with higher densities of transistors and faster clock speeds, the problems with electrical interconnects to and on silicon chips become significantly worse. Silicon based optoelectronic integration offers the promise of low-cost solutions for optical communications and interconnects. While there have been many advances in silicon optoelectronic device performance, a room temperature electrically pumped, silicon laser is one of the last hurdles holding back large scale optical integration onto a silicon platform. Many approaches to light emission and amplification in silicon have been demonstrated including Raman lasers and amplifiers, nano-patterning, nanocrystalline-Si structures, and doping silicon rich oxides with rare earths. In this report, the fabrication process module for the microdisk (which is an important device in integrated photonic circuits and has been used as building blocks for many optical processing devices) has been developed, designed for both passive (SiO2) and active (GaAs/InP) microdisk. Due to the necessary of wafer bonding in active microdisk process module development, experiments of sample preparation for TEM have also been included. |
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