Micro-deformation characterization of electronic packaging materials and assemblies

The continuing miniaturization of microelectronic assemblies and devices requires experimental micro-deformation analysis technique for material characterization and structure reliability analysis. This work investigates both theoretical aspects and practical applications of digital image correlatio...

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Main Author:	Sun, Yao Feng
Other Authors:	Pang Hock Lye, John
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	DRNTU::Engineering::Mechanical engineering
Online Access:	https://hdl.handle.net/10356/41563
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Institution:	Nanyang Technological University
Language:	English

id	sg-ntu-dr.10356-41563
record_format	dspace
spelling	sg-ntu-dr.10356-415632023-03-11T17:45:21Z Micro-deformation characterization of electronic packaging materials and assemblies Sun, Yao Feng Pang Hock Lye, John School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering The continuing miniaturization of microelectronic assemblies and devices requires experimental micro-deformation analysis technique for material characterization and structure reliability analysis. This work investigates both theoretical aspects and practical applications of digital image correlation techniques for in-plane micro- and non-scale deformation characterization of electronic packaging materials and assemblies. DOCTOR OF PHILOSOPHY (MAE) 2010-07-21T03:53:12Z 2010-07-21T03:53:12Z 2008 2008 Thesis Sun, Y. F. (2008). Micro-deformation characterization of electronic packaging materials and assemblies. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/41563 10.32657/10356/41563 en 201 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
language	English
topic	DRNTU::Engineering::Mechanical engineering
spellingShingle	DRNTU::Engineering::Mechanical engineering Sun, Yao Feng Micro-deformation characterization of electronic packaging materials and assemblies
description	The continuing miniaturization of microelectronic assemblies and devices requires experimental micro-deformation analysis technique for material characterization and structure reliability analysis. This work investigates both theoretical aspects and practical applications of digital image correlation techniques for in-plane micro- and non-scale deformation characterization of electronic packaging materials and assemblies.
author2	Pang Hock Lye, John
author_facet	Pang Hock Lye, John Sun, Yao Feng
format	Theses and Dissertations
author	Sun, Yao Feng
author_sort	Sun, Yao Feng
title	Micro-deformation characterization of electronic packaging materials and assemblies
title_short	Micro-deformation characterization of electronic packaging materials and assemblies
title_full	Micro-deformation characterization of electronic packaging materials and assemblies
title_fullStr	Micro-deformation characterization of electronic packaging materials and assemblies
title_full_unstemmed	Micro-deformation characterization of electronic packaging materials and assemblies
title_sort	micro-deformation characterization of electronic packaging materials and assemblies
publishDate	2010
url	https://hdl.handle.net/10356/41563
_version_	1761781890732261376

Micro-deformation characterization of electronic packaging materials and assemblies

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