Micro-deformation characterization of electronic packaging materials and assemblies

• Main Author: Sun, Yao Feng
• Other Authors: Pang Hock Lye, John
• Format: Theses and Dissertations
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: https://hdl.handle.net/10356/41563
• Institution: Nanyang Technological University

The continuing miniaturization of microelectronic assemblies and devices requires experimental micro-deformation analysis technique for material characterization and structure reliability analysis. This work investigates both theoretical aspects and practical applications of digital image correlatio...