A micromachined condenser microphone with SU-8 back plate

• Main Author: Tan, Zhengyi.
• Other Authors: Miao Jianmin
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Mechanical engineering::Mechatronics
• Online Access: http://hdl.handle.net/10356/41583
• Institution: Nanyang Technological University

The advancement of silicon micromachining technology has increased the commercial production potential of silicon condenser microphones. Possessing low noise and high sensitivity, silicon condenser microphones can be used in a wide range of fields like mobile communications and in hearing devices. This report presents the fabrication process of a micromachined silicon condenser microphone with SU-8 backplate using the single wafer technique. Using the stable polymer SU-8, these microphones and can be manufactured in large quantities at a relatively low cost. In previous fabrication attempts, the aluminium sacrificial layer was not etched completely due to the poor penetration of the aluminium etchant. Additional obstacles included the peeling of the electrode layer and the non-optimization of the SU-8 exposure.