Solid state diffusion bonding of superalloy X-750 in air ambience

Conventional diffusion bonding processes require a vacuum ambience. This results in high production cost and other disadvantages and limits its application. Therefore, alternative bonding methods have been sought by researchers for a long time. In this study, a novel form of diffusion bonding was pr...

全面介紹

Saved in:
書目詳細資料
主要作者: Dong, Guo Ming
其他作者: Roop Singh Chandel
格式: Theses and Dissertations
語言:English
出版: 2011
主題:
在線閱讀:http://hdl.handle.net/10356/42605
標簽: 添加標簽
沒有標簽, 成為第一個標記此記錄!