Study on the effectiveness of reservoir length in improving electromigration in Cu/Low-k interconnects

• 主要作者: Fu, Chunmiao
• 其他作者: Wu Shao Hui
• 格式: Theses and Dissertations
• 語言: English
• 出版: 2011
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
• 在線閱讀: https://hdl.handle.net/10356/43533
• 機構: Nanyang Technological University

Electromigration (EM) occurs in the form of void formation because of mass transport, reducing the electrical reliability of interconnects. The aggressive shrinkage of interconnects while maintaining at high current capability and reliability emerges EM to be a serious reliability issue, especially...