Requirement for accurate interconnect temperature measurement for electromigration test

• Main Authors: Hou, Yuejin, Tan, Cher Ming
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
• Online Access: https://hdl.handle.net/10356/90755; http://hdl.handle.net/10220/6394; http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5403696
• Institution: Nanyang Technological University

In this work, we show accurate temperature measurement is important in electromigration (EM) test as it can affect the measured activation energy EA and current density exponent n. The deviation of measured EA and n due to the interconnect...