The multiple temperature heater platforms for solder Electromigration test conducted at room temperature

• المؤلفون الرئيسيون: Hou, Yuejin, Tan, Cher Ming
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: Conference or Workshop Item
• اللغة: English
• منشور في: 2010
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/90846; http://hdl.handle.net/10220/6382

To accommodate the increasing input-out (I/O) counts in future integrated circuits, the size of the solder bumps has to shrink and current density through each solder bump increasing. With the ever-increasing current density through the solder bumps, electromigration (EM) remains as a main concern f...