The multiple temperature heater platforms for solder Electromigration test conducted at room temperature

• Main Authors: Hou, Yuejin, Tan, Cher Ming
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
• Online Access: https://hdl.handle.net/10356/90846; http://hdl.handle.net/10220/6382
• Institution: Nanyang Technological University

To accommodate the increasing input-out (I/O) counts in future integrated circuits, the size of the solder bumps has to shrink and current density through each solder bump increasing. With the ever-increasing current density through the solder bumps, electromigration (EM) remains as a main concern f...