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Hou, Yuejin
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Hou, Yuejin
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Hou, Yuejin
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1
Transient electrical thermal analysis of ESD process using 3-D finite element method
by
Hou
,
Yuejin
,
Tan, Cher Ming
Published 2010
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2
Comparison of stress-induced voiding phenomena in copper line–via structures with different dielectric materials
by
Hou
,
Yuejin
,
Tan, Cher Ming
Published 2013
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3
Requirement for accurate interconnect temperature measurement for electromigration test
by
Hou
,
Yuejin
,
Tan, Cher Ming
Published 2010
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4
The multiple temperature heater platforms for solder Electromigration test conducted at room temperature
by
Hou
,
Yuejin
,
Tan, Cher Ming
Published 2010
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