Transient electrical thermal analysis of ESD process using 3-D finite element method

• Main Authors: Hou, Yuejin, Tan, Cher Ming
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
• Online Access: https://hdl.handle.net/10356/91545; http://hdl.handle.net/10220/6395; http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5403933
• Institution: Nanyang Technological University

In this work, the transient electrical-thermal response of a simple ESD protection circuit to excessive current during an electrostatic discharge (ESD) event is investigated numerically, using 3-D finite element analysis (FEA). The 3-D tran...