Transient electrical thermal analysis of ESD process using 3-D finite element method

In this work, the transient electrical-thermal response of a simple ESD protection circuit to excessive current during an electrostatic discharge (ESD) event is investigated numerically, using 3-D finite element analysis (FEA). The 3-D tran...

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Main Authors:	Hou, Yuejin, Tan, Cher Ming
Other Authors:	School of Electrical and Electronic Engineering
Format:	Conference or Workshop Item
Language:	English
Published:	2010
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
Online Access:	https://hdl.handle.net/10356/91545 http://hdl.handle.net/10220/6395 http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5403933
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Institution:	Nanyang Technological University
Language:	English

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spelling	sg-ntu-dr.10356-915452019-12-06T18:07:36Z Transient electrical thermal analysis of ESD process using 3-D finite element method Hou, Yuejin Tan, Cher Ming School of Electrical and Electronic Engineering IEEE International Symposium on Integrated Circuits (12th : 2009 : Singapore) A*STAR SIMTech DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation In this work, the transient electrical-thermal response of a simple ESD protection circuit to excessive current during an electrostatic discharge (ESD) event is investigated numerically, using 3-D finite element analysis (FEA). The 3-D transient temperature distribution in the circuit can be revealed and the fusing phenomenon of interconnection is captured during the ESD process using human body model (HBM). The method in this work provides a quantitative approach to study the ESD damaging process in the future. Published version 2010-09-02T07:26:29Z 2019-12-06T18:07:36Z 2010-09-02T07:26:29Z 2019-12-06T18:07:36Z 2009 2009 Conference Paper Hou, Y., & Tan, C. M. (2009). Transient electrical thermal analysis of ESD process using 3-D finite element method. In proceedings of the 12th International Symposium on Integrated Circuits: Singapore, (pp.129-132). https://hdl.handle.net/10356/91545 http://hdl.handle.net/10220/6395 http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5403933 en © 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. 4 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
country	Singapore
collection	DR-NTU
language	English
topic	DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation Hou, Yuejin Tan, Cher Ming Transient electrical thermal analysis of ESD process using 3-D finite element method
description	In this work, the transient electrical-thermal response of a simple ESD protection circuit to excessive current during an electrostatic discharge (ESD) event is investigated numerically, using 3-D finite element analysis (FEA). The 3-D transient temperature distribution in the circuit can be revealed and the fusing phenomenon of interconnection is captured during the ESD process using human body model (HBM). The method in this work provides a quantitative approach to study the ESD damaging process in the future.
author2	School of Electrical and Electronic Engineering
author_facet	School of Electrical and Electronic Engineering Hou, Yuejin Tan, Cher Ming
format	Conference or Workshop Item
author	Hou, Yuejin Tan, Cher Ming
author_sort	Hou, Yuejin
title	Transient electrical thermal analysis of ESD process using 3-D finite element method
title_short	Transient electrical thermal analysis of ESD process using 3-D finite element method
title_full	Transient electrical thermal analysis of ESD process using 3-D finite element method
title_fullStr	Transient electrical thermal analysis of ESD process using 3-D finite element method
title_full_unstemmed	Transient electrical thermal analysis of ESD process using 3-D finite element method
title_sort	transient electrical thermal analysis of esd process using 3-d finite element method
publishDate	2010
url	https://hdl.handle.net/10356/91545 http://hdl.handle.net/10220/6395 http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5403933
_version_	1681035171856384000

Transient electrical thermal analysis of ESD process using 3-D finite element method

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