Transient electrical thermal analysis of ESD process using 3-D finite element method

• Main Authors: Hou, Yuejin, Tan, Cher Ming
• 其他作者: School of Electrical and Electronic Engineering
• 格式: Conference or Workshop Item
• 語言: English
• 出版: 2010
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
• 在線閱讀: https://hdl.handle.net/10356/91545; http://hdl.handle.net/10220/6395; http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5403933
• 機構: Nanyang Technological University

In this work, the transient electrical-thermal response of a simple ESD protection circuit to excessive current during an electrostatic discharge (ESD) event is investigated numerically, using 3-D finite element analysis (FEA). The 3-D transient temperature distribution in the circuit can be revealed and the fusing phenomenon of interconnection is captured during the ESD process using human body model (HBM). The method in this work provides a quantitative approach to study the ESD damaging process in the future.