Transient electrical thermal analysis of ESD process using 3-D finite element method

Transient electrical thermal analysis of ESD process using 3-D finite element method

In this work, the transient electrical-thermal response of a simple ESD protection circuit to excessive current during an electrostatic discharge (ESD) event is investigated numerically, using 3-D finite element analysis (FEA). The 3-D tran...

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Bibliographic Details
Main Authors: Hou, Yuejin, Tan, Cher Ming
Other Authors: School of Electrical and Electronic Engineering
Format: Conference or Workshop Item
Language:English
Published: 2010
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
Online Access:https://hdl.handle.net/10356/91545
http://hdl.handle.net/10220/6395
http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5403933
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Institution: Nanyang Technological University
Language: English
Description
Summary:In this work, the transient electrical-thermal response of a simple ESD protection circuit to excessive current during an electrostatic discharge (ESD) event is investigated numerically, using 3-D finite element analysis (FEA). The 3-D transient temperature distribution in the circuit can be revealed and the fusing phenomenon of interconnection is captured during the ESD process using human body model (HBM). The method in this work provides a quantitative approach to study the ESD damaging process in the future.

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