The multiple temperature heater platforms for solder Electromigration test conducted at room temperature

• Main Authors: Hou, Yuejin, Tan, Cher Ming
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
• Online Access: https://hdl.handle.net/10356/90846; http://hdl.handle.net/10220/6382
• Institution: Nanyang Technological University

To accommodate the increasing input-out (I/O) counts in future integrated circuits, the size of the solder bumps has to shrink and current density through each solder bump increasing. With the ever-increasing current density through the solder bumps, electromigration (EM) remains as a main concern for the reliability of future solder bumps. This phenomenon is responsible for the structural damage of solder bumps in the form of void formation caused by ionic diffusion driven by high electron wind force. Conventional solder bump EM test is performed in high temperature oven with high stress current. Besides the high cost oven, the total test time can be very long as the EM test has to be performed at several different temperatures and EM failure for solder bumps is usually much longer than their interconnect counterpart. In this work, we propose a multiple temperature heater platform for solder EM test conducted at room temperature. This platform eliminates the use of high cost oven. In addition, the solder joints can be tested at different temperatures simultaneously, shorting the total required EM test time. This proposal is verified by ANSYS@ finite element simulations through the corresponding electrical-thermal analysis.