Design and building of solder and TSV daisy chain electromigration tester

• Main Author: Ser, Edwin Wei Jun.
• Other Authors: Tan Cher Ming
• Format: Final Year Project
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
• Online Access: http://hdl.handle.net/10356/45223
• Institution: Nanyang Technological University

Through Silicon Via (TSV) is a hot topic in today’s 3D Integrated Circuit. In order for TSV to be used commercially, reliable evaluation of TSV is necessary, especially on its electromigration. To assess the electromigration reliability of different types of interconnects experimentally, EM tests th...