Design and building of solder and TSV daisy chain electromigration tester

• Main Author: Ser, Edwin Wei Jun.
• Other Authors: Tan Cher Ming
• Format: Final Year Project
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
• Online Access: http://hdl.handle.net/10356/45223
• Institution: Nanyang Technological University

Through Silicon Via (TSV) is a hot topic in today’s 3D Integrated Circuit. In order for TSV to be used commercially, reliable evaluation of TSV is necessary, especially on its electromigration. To assess the electromigration reliability of different types of interconnects experimentally, EM tests that involve the monitoring of DUT’s resistance under high temperature and current stress conditions are conducted. The test structure will be a failure if its resistance reaches a predetermined value. In order to carry out the EM experiment on TSV test chip, an in-house EM tester control block is specifically designed and built onto the PCB Board. Even though various commercial EM Tester such as ‘Qualitau’ can be readily found in the market, but it is not appropriate for this application. Qualitau have several advantages such as dedicated true current source for each DUT, compatibility with various test structures, built in data logging and analysis, integrated oven but due to the high cost and lack of features such as the ability to incorporate various resistance monitoring methods and source very high current, makes it inappropriate to be used in this application. The procedure of setting up the EM test circuit and constructing the PCB board will be explained.