Electromigration study of through silicon via (TSV)

• المؤلف الرئيسي: Tan, Yeow Chong
• مؤلفون آخرون: Tan Cher Ming
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2011
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/43544

In the continuous drive for smaller chips (Moore’s Law) and heterogeneous semiconductor applications, traditional processing and packaging technologies may not be able to support this trend. 3-D IC can offer a greater packing density in the same footprint as 2-D miniaturizing is reaching its physic...