Electromigration study of through silicon via (TSV)

• 主要作者: Tan, Yeow Chong
• 其他作者: Tan Cher Ming
• 格式: Theses and Dissertations
• 語言: English
• 出版: 2011
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
• 在線閱讀: https://hdl.handle.net/10356/43544

In the continuous drive for smaller chips (Moore’s Law) and heterogeneous semiconductor applications, traditional processing and packaging technologies may not be able to support this trend. 3-D IC can offer a greater packing density in the same footprint as 2-D miniaturizing is reaching its physic...