Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits

• Main Author: I Made Riko
• Other Authors: Gan Chee Lip
• Format: Theses and Dissertations
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: https://hdl.handle.net/10356/43639
• Institution: Nanyang Technological University

Vertically stacking and bonding individual processed wafers with through-Si vias (TSV) to form three dimensional integrated circuits (3DIC) introduces the possibility of reducing signal propagation delay, a reduction in power consumption and heterogeneous device integration. Cu thermocompression bon...