Study on kinetics of IMC formation through simple in-situ experiments for 3D IC applications

• Main Author: Foo, Jie Sheng.
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Materials
• Online Access: http://hdl.handle.net/10356/44574
• Institution: Nanyang Technological University

One of the challenges in realization of 3D IC is the requirement of having low processing temperatures. In order to overcome such challenges, researches have been conducted in an attempt to lower down the bonding temperature. One such way would be through the usage of low temperature solders such as...