Compositional dependence of Sn-Bi solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales
Many alloys can be used for soldering and tin-lead (Sn-Pb) solder is one of the most widely used. However, the usage of lead leads to undesirable environmental damage. Therefore, there is an increasing demand for lead-free solder, especially low melting temperature solders that can be used in device...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
2013
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| Online Access: | http://hdl.handle.net/10356/52092 |
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| Institution: | Nanyang Technological University |
| Language: | English |