Compositional dependence of Sn-Bi solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales

• Main Author: Zhou, Yingxiu.
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Materials
• Online Access: http://hdl.handle.net/10356/52092
• Institution: Nanyang Technological University

Many alloys can be used for soldering and tin-lead (Sn-Pb) solder is one of the most widely used. However, the usage of lead leads to undesirable environmental damage. Therefore, there is an increasing demand for lead-free solder, especially low melting temperature solders that can be used in device...