Bonding of microfluidic devices

• Main Author: Ng, Teck Chun.
• Other Authors: Tor Shu Beng
• Format: Final Year Project
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/44638
• Institution: Nanyang Technological University

A study on the characteristics of ultrasonic bonding of micro-injection molded parts and its implication on the part’s structure integrity was conducted. One-factor-at-a-time method was utilized to study the effects of varying trigger pressure, amplitude and weld time on parts molded from Cyclic Olefin Copolymer (COC) and Poly (Methyl Methacrylate) Acrylic (PMMA) resin. Setting for acceptable weld appearance was obtained. However, no combination of parameters was found to result in proper flow on the micro fluidic channels due to the gaps contributed by the un-fused energy directors. Hot plate welding was employed at the later stage of the project as a solution to minimize the gaps that were form by the un-fused energy directors. Setting for acceptable weld appearance was obtained. However, no combination of parameters was found to result in proper flow on the micro fluidic channels due to the high pressure distribution gradient on the plate. Finally, recommendations were made for possible future work and other improvements that could be made to the bonding process of micro fluidic devices.