Bonding of microfluidic devices
A study on the characteristics of ultrasonic bonding of micro-injection molded parts and its implication on the part’s structure integrity was conducted. One-factor-at-a-time method was utilized to study the effects of varying trigger pressure, amplitude and weld time on parts molded from Cyclic Ol...
Saved in:
Main Author: | Ng, Teck Chun. |
---|---|
Other Authors: | Tor Shu Beng |
Format: | Final Year Project |
Language: | English |
Published: |
2011
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/44638 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Polymer microfluidic devices : sealing and lamination of topas microfluidic devices by thermal bonding
by: Li, Aaron Shi Wei.
Published: (2010) -
Thermal bonding of thermoplastic microfluidic devices
by: Nor Aza Hussain
Published: (2014) -
Polymer microfluidic devices : effect of surface treatment on bonding and flow
by: Lim, Glendon Nigel Yong Kwang.
Published: (2010) -
Strength and toughness of bonded joints in thermoplastic polymer microfluidic devices
by: Toh, Ming Loon.
Published: (2011) -
An experimental investigation of the surface modification and thermal bonding of cyclic olefin copolymer for microfluidic devices
by: Tan, Lorraine Yu Lin.
Published: (2011)