Electrical modeling of through-silicon-via for 3D integrated circuits

117 p.

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Bibliographic Details
Main Author:	Santhosh Onkaraiah.
Other Authors:	Tan Chuan Seng
Format:	Theses and Dissertations
Published:	2011
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Online Access:	http://hdl.handle.net/10356/46790
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-46790
record_format	dspace
spelling	sg-ntu-dr.10356-467902023-07-04T15:02:16Z Electrical modeling of through-silicon-via for 3D integrated circuits Santhosh Onkaraiah. Tan Chuan Seng School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits 117 p. Increased use of technology in day to day life for seamless activity and increased living comforts have been driving the Integrated Circuit (IC) industry to produce better hardware at cheaper and faster rate. Hence Ultra Large Scale Integration (ULSI) of ICs is accelerating to account for the need of high speed systems. Traditional scaling alone is believed to be insufficient to satisfy the interconnect performance going forward. Hence equivalent scaling using unconventional approaches would be necessary. As the scaling of integrated circuits to achieve faster, denser and smaller devices continues to drive the industry, we are at the juncture where many hurdles need to be addressed to continue on this remarkable journey of semiconductors. International Technology Roadmap for Semiconductors [ITRS] projects that the device delay is continuously scaling down but interconnect delays are increasing at a rapid rate for global and semi global interconnects Master of Science (Electronics) 2011-12-23T09:53:52Z 2011-12-23T09:53:52Z 2011 Thesis http://hdl.handle.net/10356/46790 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits Santhosh Onkaraiah. Electrical modeling of through-silicon-via for 3D integrated circuits
description	117 p.
author2	Tan Chuan Seng
author_facet	Tan Chuan Seng Santhosh Onkaraiah.
format	Theses and Dissertations
author	Santhosh Onkaraiah.
author_sort	Santhosh Onkaraiah.
title	Electrical modeling of through-silicon-via for 3D integrated circuits
title_short	Electrical modeling of through-silicon-via for 3D integrated circuits
title_full	Electrical modeling of through-silicon-via for 3D integrated circuits
title_fullStr	Electrical modeling of through-silicon-via for 3D integrated circuits
title_full_unstemmed	Electrical modeling of through-silicon-via for 3D integrated circuits
title_sort	electrical modeling of through-silicon-via for 3d integrated circuits
publishDate	2011
url	http://hdl.handle.net/10356/46790
_version_	1772826692468867072

Electrical modeling of through-silicon-via for 3D integrated circuits

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