Electrical modeling of through-silicon-via for 3D integrated circuits
117 p.
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Published: |
2011
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/46790 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |