Interface characterization of wafer bonding
189 p.
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2011
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| Online Access: | https://hdl.handle.net/10356/46809 |
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| Institution: | Nanyang Technological University |
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sg-ntu-dr.10356-468092023-07-04T17:38:55Z Interface characterization of wafer bonding Sun, Lina Tan Cher Ming School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering 189 p. Wafer bonding technology presents one way of fabricating power diode devices directly rather than in a semiconductor bulk. It provides an effective way with great potential for the power diode mass production. However, for practical applications of wafer bonding technique, it is important to determine the optimized process conditions to achieve good electrical performance. MASTER OF ENGINEERING (EEE) 2011-12-23T09:57:21Z 2011-12-23T09:57:21Z 2009 2009 Thesis Sun, L. (2009). Interface characterization of wafer bonding. Master’s thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/46809 10.32657/10356/46809 Nanyang Technological University application/pdf |
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Asia |
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Singapore Singapore |
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DRNTU::Engineering::Electrical and electronic engineering |
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DRNTU::Engineering::Electrical and electronic engineering Sun, Lina Interface characterization of wafer bonding |
| description |
189 p. |
| author2 |
Tan Cher Ming |
| author_facet |
Tan Cher Ming Sun, Lina |
| format |
Theses and Dissertations |
| author |
Sun, Lina |
| author_sort |
Sun, Lina |
| title |
Interface characterization of wafer bonding |
| title_short |
Interface characterization of wafer bonding |
| title_full |
Interface characterization of wafer bonding |
| title_fullStr |
Interface characterization of wafer bonding |
| title_full_unstemmed |
Interface characterization of wafer bonding |
| title_sort |
interface characterization of wafer bonding |
| publishDate |
2011 |
| url |
https://hdl.handle.net/10356/46809 |
| _version_ |
1772827641298026496 |