Monolithic integration of GAAS-to-SI by direct wafer bonding

While Silicon remains the dominant material today in matured very-large-scale-integration technology, most of the III-V compound semiconductors are direct bandgap materials with high electron mobilities that are highly sought in advanced space, automobile, and telecommunication applications. Hence,...

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Bibliographic Details
Main Author: Yeo, Chiew Yong
Other Authors: Eugene A Fitzgerald
Format: Theses and Dissertations
Language:English
Published: 2014
Subjects:
Online Access:https://hdl.handle.net/10356/61132
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Institution: Nanyang Technological University
Language: English