Monolithic integration of GAAS-to-SI by direct wafer bonding

• Main Author: Yeo, Chiew Yong
• Other Authors: Eugene A Fitzgerald
• Format: Theses and Dissertations
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/61132
• Institution: Nanyang Technological University

While Silicon remains the dominant material today in matured very-large-scale-integration technology, most of the III-V compound semiconductors are direct bandgap materials with high electron mobilities that are highly sought in advanced space, automobile, and telecommunication applications. Hence,...