Novel low cost approach to packaging MEMS accelerometer
104 p.
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2011
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| Online Access: | http://hdl.handle.net/10356/47245 |
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sg-ntu-dr.10356-472452023-03-11T17:19:01Z Novel low cost approach to packaging MEMS accelerometer Kee, Kian Heong. Miao Jianmin School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing 104 p. A Low cost and robust solution for MEMS piezoresistive accelerometer has been proposed and fabricated. This project works on the product concept for MEMS (micro-electro-mechanical system) that it must be overmolded to suit customer's requirement without affecting the electrical performance of the device. Another strong point of this product is that it is cheaper as its substrate is made of FR4 material. Master of Science (Micro Electro Mechanical Systems Engineering) 2011-12-27T06:42:29Z 2011-12-27T06:42:29Z 2004 2004 Thesis http://hdl.handle.net/10356/47245 Nanyang Technological University application/pdf |
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Singapore Singapore |
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DRNTU::Engineering::Manufacturing |
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DRNTU::Engineering::Manufacturing Kee, Kian Heong. Novel low cost approach to packaging MEMS accelerometer |
| description |
104 p. |
| author2 |
Miao Jianmin |
| author_facet |
Miao Jianmin Kee, Kian Heong. |
| format |
Theses and Dissertations |
| author |
Kee, Kian Heong. |
| author_sort |
Kee, Kian Heong. |
| title |
Novel low cost approach to packaging MEMS accelerometer |
| title_short |
Novel low cost approach to packaging MEMS accelerometer |
| title_full |
Novel low cost approach to packaging MEMS accelerometer |
| title_fullStr |
Novel low cost approach to packaging MEMS accelerometer |
| title_full_unstemmed |
Novel low cost approach to packaging MEMS accelerometer |
| title_sort |
novel low cost approach to packaging mems accelerometer |
| publishDate |
2011 |
| url |
http://hdl.handle.net/10356/47245 |
| _version_ |
1761781380214161408 |