Micro-doping in ultrafine-grained gold bonding wires

227 p.

Saved in:
Bibliographic Details
Main Author: Chew, Effie Yeong Huey
Other Authors: Wong Chee Cheong
Format: Theses and Dissertations
Published: 2011
Subjects:
Online Access:https://hdl.handle.net/10356/47295
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
id sg-ntu-dr.10356-47295
record_format dspace
spelling sg-ntu-dr.10356-472952023-03-04T16:48:02Z Micro-doping in ultrafine-grained gold bonding wires Chew, Effie Yeong Huey Wong Chee Cheong School of Materials Science & Engineering DRNTU::Engineering::Materials 227 p. Wire bonding remains the dominant form of interconnection technology, and is expected to be used in 85% of total IC units worldwide by 2010. As device miniaturization continues, the diameters of wires get finer, requiring higher mechanical strength from the thin wires for handling. However, strong wires with low ductility pose an insurmountable hurdle in manufacturing because of formability issues. Therefore, strategies to attain both high strength and ductility (dual improvement) in Au wires need to be developed, a goal shared by researchers in the field of nanocrystalline (NC) and ultrafine-grained (UFG) materials. DOCTOR OF PHILOSOPHY (MSE) 2011-12-27T06:54:43Z 2011-12-27T06:54:43Z 2009 2009 Thesis Chew, E. Y. H. (2009). Micro-doping in ultrafine-grained gold bonding wires. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/47295 10.32657/10356/47295 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Materials
spellingShingle DRNTU::Engineering::Materials
Chew, Effie Yeong Huey
Micro-doping in ultrafine-grained gold bonding wires
description 227 p.
author2 Wong Chee Cheong
author_facet Wong Chee Cheong
Chew, Effie Yeong Huey
format Theses and Dissertations
author Chew, Effie Yeong Huey
author_sort Chew, Effie Yeong Huey
title Micro-doping in ultrafine-grained gold bonding wires
title_short Micro-doping in ultrafine-grained gold bonding wires
title_full Micro-doping in ultrafine-grained gold bonding wires
title_fullStr Micro-doping in ultrafine-grained gold bonding wires
title_full_unstemmed Micro-doping in ultrafine-grained gold bonding wires
title_sort micro-doping in ultrafine-grained gold bonding wires
publishDate 2011
url https://hdl.handle.net/10356/47295
_version_ 1759853234259755008