Hermetic sealing of MEMS sensors for high temperature electronics applications

In this study, 100 μm sealing width of both Al-Ge eutectic bonds and Pt-In Transient Liquid Phase bonds were fabricated and evaluated. The experiments were conducted to determine the feasibility of the bonding for usage in high temperature applications. The samples underwent shear tes...

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Bibliographic Details
Main Author: Muhammad Afiq Sani.
Other Authors: Gan Chee Lip
Format: Final Year Project
Language:English
Published: 2012
Subjects:
Online Access:http://hdl.handle.net/10356/48873
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Institution: Nanyang Technological University
Language: English