Hermetic sealing of MEMS sensors for high temperature electronics applications
In this study, 100 μm sealing width of both Al-Ge eutectic bonds and Pt-In Transient Liquid Phase bonds were fabricated and evaluated. The experiments were conducted to determine the feasibility of the bonding for usage in high temperature applications. The samples underwent shear tes...
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Format: | Final Year Project |
Language: | English |
Published: |
2012
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Online Access: | http://hdl.handle.net/10356/48873 |
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Institution: | Nanyang Technological University |
Language: | English |