Hermetic sealing of MEMS sensors for high temperature electronics applications

• Main Author: Muhammad Afiq Sani.
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials::Testing of materials; DRNTU::Engineering::Materials::Functional materials
• Online Access: http://hdl.handle.net/10356/48873
• Institution: Nanyang Technological University

In this study, 100 μm sealing width of both Al-Ge eutectic bonds and Pt-In Transient Liquid Phase bonds were fabricated and evaluated. The experiments were conducted to determine the feasibility of the bonding for usage in high temperature applications. The samples underwent shear tes...