Hermetic sealing of MEMS sensors for high temperature electronics applications

• المؤلف الرئيسي: Muhammad Afiq Sani.
• مؤلفون آخرون: Gan Chee Lip
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials::Testing of materials; DRNTU::Engineering::Materials::Functional materials
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/48873
• المؤسسة: Nanyang Technological University

In this study, 100 μm sealing width of both Al-Ge eutectic bonds and Pt-In Transient Liquid Phase bonds were fabricated and evaluated. The experiments were conducted to determine the feasibility of the bonding for usage in high temperature applications. The samples underwent shear tes...