Hermetic sealing of MEMS sensors for high temperature electronics applications

In this study, 100 μm sealing width of both Al-Ge eutectic bonds and Pt-In Transient Liquid Phase bonds were fabricated and evaluated. The experiments were conducted to determine the feasibility of the bonding for usage in high temperature applications. The samples underwent shear tes...

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書目詳細資料
主要作者: Muhammad Afiq Sani.
其他作者: Gan Chee Lip
格式: Final Year Project
語言:English
出版: 2012
主題:
在線閱讀:http://hdl.handle.net/10356/48873
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機構: Nanyang Technological University
語言: English