Effect of stress migration on electromigration for nano scale advanced interconnects

• المؤلف الرئيسي: Anson Heryanto
• مؤلفون آخرون: Pey Kin Leong
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/50271

The interconnect system is a significant part of the integrated circuit because of its function to connect millions of transistors, and routing signals into and out of the chip. Therefore, investigating its reliability is a priority for the industry to ensure that the chip lifetime will meet the req...