Role of dopants on the properties of gold bonding wire

Role of dopants on the properties of gold bonding wire

Gold bonding wire is a widely used electrically conducting interconnection in microelectronics industry, due to its good combination of inertness and low resistivity. The increasing miniaturization of electronics required the reduction in the pitch of the input/output inter-connections, and conseque...

Full description

Saved in:
Bibliographic Details
Main Author: Saraswati.
Other Authors: Sritharan, Thirumany
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:http://hdl.handle.net/10356/5103
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
id sg-ntu-dr.10356-5103
record_format dspace
spelling sg-ntu-dr.10356-51032023-03-04T16:34:04Z Role of dopants on the properties of gold bonding wire Saraswati. Sritharan, Thirumany School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Gold bonding wire is a widely used electrically conducting interconnection in microelectronics industry, due to its good combination of inertness and low resistivity. The increasing miniaturization of electronics required the reduction in the pitch of the input/output inter-connections, and consequently made it necessary to reduce the wire diameter, while maintaining, or even increasing its performance. Doctor of Philosophy (SME) 2008-09-17T10:20:03Z 2008-09-17T10:20:03Z 2004 2004 Thesis http://hdl.handle.net/10356/5103 Nanyang Technological University 97 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
spellingShingle DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Saraswati.
Role of dopants on the properties of gold bonding wire
description Gold bonding wire is a widely used electrically conducting interconnection in microelectronics industry, due to its good combination of inertness and low resistivity. The increasing miniaturization of electronics required the reduction in the pitch of the input/output inter-connections, and consequently made it necessary to reduce the wire diameter, while maintaining, or even increasing its performance.
author2 Sritharan, Thirumany
author_facet Sritharan, Thirumany
Saraswati.
format Theses and Dissertations
author Saraswati.
author_sort Saraswati.
title Role of dopants on the properties of gold bonding wire
title_short Role of dopants on the properties of gold bonding wire
title_full Role of dopants on the properties of gold bonding wire
title_fullStr Role of dopants on the properties of gold bonding wire
title_full_unstemmed Role of dopants on the properties of gold bonding wire
title_sort role of dopants on the properties of gold bonding wire
publishDate 2008
url http://hdl.handle.net/10356/5103
_version_ 1759854209863254016

Similar Items