Role of dopants on the properties of gold bonding wire

• Main Author: Saraswati.
• Other Authors: Sritharan, Thirumany
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: http://hdl.handle.net/10356/5103
• Institution: Nanyang Technological University

Gold bonding wire is a widely used electrically conducting interconnection in microelectronics industry, due to its good combination of inertness and low resistivity. The increasing miniaturization of electronics required the reduction in the pitch of the input/output inter-connections, and conseque...