Evaluation of tungsten metallization on alumina substrates for extreme environment package level interconnection

• Main Author: Huang, Clare Guanqi.
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering
• Online Access: http://hdl.handle.net/10356/52006
• Institution: Nanyang Technological University

The demand for high performance electronics has increased significantly over the past few decades. Metallization is widely used as to connect devices electrically to each other and to the outside environment. This study aims to study and analyze the effects of tungsten metallization on alumina substrates for extreme environment package level interconnection. The results of these effects will be compared to aluminium and silver metallization on alumina substrates. Aluminium has been commonly used as metallization on integrated circuits for interconnects for decades, as such making the comparison of tungsten to alumina justifiable. On the other hand, silver is known to have one of the poorest adhesions on alumina substrates, hence also selected to be used as our control as the other extreme in this experiment. In this research study, deposition of metal on alumina substrate will be done followed by aging in high temperature and high pressure environment. After aging, characterization tests such as the pull test, chevron test and electrical test will be done in order to study the effects that the extreme environment has on the metallization on alumina substrates to decide if tungsten will be a suitable material for metallization as part of the package level interconnection.