Evaluation of tungsten metallization on alumina substrates for extreme environment package level interconnection

• Main Author: Huang, Clare Guanqi.
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering
• Online Access: http://hdl.handle.net/10356/52006
• Institution: Nanyang Technological University

The demand for high performance electronics has increased significantly over the past few decades. Metallization is widely used as to connect devices electrically to each other and to the outside environment. This study aims to study and analyze the effects of tungsten metallization on alumina su...