Development of carbon nanotubes for interconnects and nano-packaging applications
As the scaling in CMOS technology is nearing its limits, the new scaling trend emphasize on making chips smaller, with higher performance and more functionality. This is putting a huge demand on the backend packaging modules, and the industries are now looking at the various challenges faced at the...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2014
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| Online Access: | http://hdl.handle.net/10356/61597 |
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| Institution: | Nanyang Technological University |
| Language: | English |