Development of carbon nanotubes for interconnects and nano-packaging applications

• Main Author: Yap, Ray Chin Chong
• Other Authors: Tay Beng Kang
• Format: Theses and Dissertations
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering
• Online Access: http://hdl.handle.net/10356/61597
• Institution: Nanyang Technological University

As the scaling in CMOS technology is nearing its limits, the new scaling trend emphasize on making chips smaller, with higher performance and more functionality. This is putting a huge demand on the backend packaging modules, and the industries are now looking at the various challenges faced at the...