Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects

Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects

10.1088/0957-4484/18/30/305306

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Bibliographic Details
Main Authors: Sharma, G., Chong, C.S., Ebin, L., Kripesh, V., Gan, C.L., Sow, C.H.
Other Authors: PHYSICS
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/97502
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/97502

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